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Our thin film structures are used in a wide range of fields including oil and gas exploration, aerospace and medical applications.

We manufacture customer-specific and standard products in thin film technology:

  • Highly integrated thin film interconnection
  • Interconnection structures combined with flip-chip and chip & wire pads on one substrate
  • Substrate bumping for flip-chip-technology
  • Integrated thin film resistors
  • Precise HF-structures
  • Substrate through hole technology
  • High line & space resolution
  • RoHS-compliant

If you need further technical advise or assistance please contact us. Our development department is looking forward to new challenges!