Assembly and interconnection structures

Assembly and interconnection structures with flip chip, chip & wire and SMD contacts

  • Highly-integrated thin-film wiring
  • Combination structures with flip chip and chip & wire on one substrate
  • Substrate bumping for flip-chip assembly
  • Integrated DF-resistors
  • Precise HF structures
  • Substrate plated through-hole
  • High structural resolution
  • RoHS compliant
Zurück | Nach oben